Intel BFCBASE Data Sheet - Page 99
Table 6-4., Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table, Table 6-5., Quad-Core
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Thermal Specifications Table 6-4. Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 TCASE_MAX (° C) 45.0 46.6 48.2 49.9 51.5 53.1 54.7 56.3 58.0 59.6 61.2 62.8 64.4 66.0 Table 6-5. Quad-Core Intel® Xeon® L7345 Processor Thermal Specifications Core Frequency Launch to FMB Thermal Design Power (W) 50 Minimum TCASE (°C) 5 Maximum TCASE (°C) Notes See Figure 6-3; 1, 2, 3, 4, 5, 6 Table 6-6 Notes: 1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at specified ICC. Please refer to the loadline specifications in Section 2. 2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is measured at maximum TCASE. 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 4. These specifications are based on initial silicon characterization. These specifications may be further updated as more characterization data becomes available. 5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® L7345 Processor may be shipped under multiple VIDs for each frequency. 6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Document Number: 318080-002 99