Intel BFCBASE Data Sheet - Page 4

Features, Boxed Processor Specifications, Debug Tools Specifications

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Page 4 highlights

6.2.3 Thermal Monitor 2 104 6.2.4 On-Demand Mode 105 6.2.5 PROCHOT# Signal 106 6.2.6 FORCEPR# Signal 106 6.2.7 THERMTRIP# Signal 106 6.3 Platform Environment Control Interface (PECI 107 6.3.1 Introduction 107 6.3.2 PECI Specifications 108 7 Features ...111 7.1 Power-On Configuration Options 111 7.2 Clock Control and Low Power States 111 7.2.1 Normal State 112 7.2.2 HALT or Extended HALT State 112 7.2.3 Stop-Grant State 114 7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State 115 7.3 Enhanced Intel SpeedStep® Technology 115 7.4 System Management Bus (SMBus) Interface 116 7.4.1 SMBus Device Addressing 117 7.4.2 PIROM and Scratch EEPROM Supported SMBus Transactions 118 7.4.3 Processor Information ROM (PIROM 119 7.4.4 Checksums 137 7.4.5 Scratch EEPROM 137 8 Boxed Processor Specifications 139 8.1 Introduction ...139 8.2 Thermal Specifications 139 8.2.1 Boxed Processor Cooling Requirements 139 9 Debug Tools Specifications 141 9.1 Debug Port System Requirements 141 9.2 Logic Analyzer Interface (LAI 141 9.2.1 Mechanical Considerations 141 9.2.2 Electrical Considerations 142 4 Document Number: 318080-002

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4
Document Number: 318080-002
6.2.3
Thermal Monitor 2
................................................................................
104
6.2.4
On-Demand Mode
.................................................................................
105
6.2.5
PROCHOT# Signal
................................................................................
106
6.2.6
FORCEPR# Signal
.................................................................................
106
6.2.7
THERMTRIP# Signal
..............................................................................
106
6.3
Platform Environment Control Interface (PECI)
....................................................
107
6.3.1
Introduction
.........................................................................................
107
6.3.2
PECI Specifications
...............................................................................
108
7
Features
................................................................................................................
111
7.1
Power-On Configuration Options
........................................................................
111
7.2
Clock Control and Low Power States
...................................................................
111
7.2.1
Normal State
.......................................................................................
112
7.2.2
HALT or Extended HALT State
.................................................................
112
7.2.3
Stop-Grant State
..................................................................................
114
7.2.4
Extended HALT Snoop or HALT Snoop State, Stop Grant
Snoop State
.........................................................................................
115
7.3
Enhanced Intel SpeedStep® Technology
.............................................................
115
7.4
System Management Bus (SMBus) Interface
.......................................................
116
7.4.1
SMBus Device Addressing
......................................................................
117
7.4.2
PIROM and Scratch EEPROM Supported SMBus Transactions
.......................
118
7.4.3
Processor Information ROM (PIROM)
.......................................................
119
7.4.4
Checksums
..........................................................................................
137
7.4.5
Scratch EEPROM
...................................................................................
137
8
Boxed Processor Specifications
..............................................................................
139
8.1
Introduction
....................................................................................................
139
8.2
Thermal Specifications
......................................................................................
139
8.2.1
Boxed Processor Cooling Requirements
....................................................
139
9
Debug Tools Specifications
....................................................................................
141
9.1
Debug Port System Requirements
......................................................................
141
9.2
Logic Analyzer Interface (LAI)
...........................................................................
141
9.2.1
Mechanical Considerations
.....................................................................
141
9.2.2
Electrical Considerations
........................................................................
142