Intel S2600GZ S2600GZ/GL - Page 14

Outline, Server Board Use Disclaimer - datasheet

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Intel® Server Board S2600GZ/GL TPS Introduction 1. Introduction This Technical Product Specification (TPS) provides board-specific information detailing the features, functionality, and high-level architecture of the Intel® Server Boards S2600GZ and S2600GL. Design-level information related to specific server board components and subsystems can be obtained by ordering External Product Specifications (EPS) or External Design Specifications (EDS) related to this server generation. EPS and EDS documents are made available under NDA with Intel and must be ordered through your local Intel representative. See the Reference Documents section for a list of available documents. 1.1 Chapter Outline This document is divided into the following chapters:  Chapter 1 - Introduction  Chapter 2 - Product Overview  Chapter 3 - Product Architecture Overview  Chapter 4 - System Security  Chapter 5 - Technology Support  Chapter 6 - Platform Management Functional Overview  Chapter 7 - Advanced Management Feature Support (RMM4)  Chapter 8 - On-board Connector/Header Overview  Chapter 9 - Reset and Recovery Jumpers  Chapter 10 - Light-Guided Diagnostics  Chapter 11 - Power Supply Specification Guidelines  Chapter 12 - BIOS Setup Utility  Appendix A - Integration and Usage Tips  Appendix B - Integrated BMC Sensor Tables  Appendix C - Management Engine Generated SEL Event Messages  Appendix D - POST Code Diagnostic LED Decoder  Appendix E - POST Code Errors  Appendix F - Supported Intel® Server Systems 1.2 Server Board Use Disclaimer Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel® ensures through its own chassis development and testing that when Intel® server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel®developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Revision 1.1 1 Intel order number G24881-004

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Intel® Server Board S2600GZ/GL TPS
Introduction
Revision 1.1
Intel order number G24881-004
1
1.
Introduction
This Technical Product Specification (TPS) provides board-specific information detailing the
features, functionality, and high-level architecture of the Intel
®
Server Boards S2600GZ and
S2600GL.
Design-level information related to specific server board components and subsystems can be
obtained by ordering External Product Specifications (EPS) or External Design Specifications
(EDS) related to this server generation. EPS and EDS documents are made available under
NDA with Intel and must be ordered through your local Intel
representative. See the Reference
Documents
section for a list of available documents.
1.1
Chapter Outline
This document is divided into the following chapters:
Chapter 1
Introduction
Chapter 2
Product Overview
Chapter 3
Product Architecture Overview
Chapter 4
System Security
Chapter 5
Technology Support
Chapter 6
Platform Management Functional Overview
Chapter 7
Advanced Management Feature Support (RMM4)
Chapter 8
On-board Connector/Header Overview
Chapter 9
Reset and Recovery Jumpers
Chapter 10
Light-Guided Diagnostics
Chapter 11
Power Supply Specification Guidelines
Chapter 12
BIOS Setup Utility
Appendix A
Integration and Usage Tips
Appendix B
Integrated BMC Sensor Tables
Appendix C
Management Engine Generated SEL Event Messages
Appendix D
POST Code Diagnostic LED Decoder
Appendix E
POST Code Errors
Appendix F
Supported Intel
®
Server Systems
1.2
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Intel
®
ensures through
its own chassis development and testing that when Intel
®
server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel
®
-
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of airflow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or
non-operating limits.