Intel S2600GZ S2600GZ/GL - Page 24

Processor Support

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Intel® Server Board S2600GZ/GL TPS Product Architecture Overview 3.1 Processor Support The server board includes two Socket-R (LGA2011) processor sockets and can support one or two of the following processors:  Intel® Xeon® processor E5-2600 product family, with a Thermal Design Power (TDP) of up to 135W. Note: Previous generation Intel® Xeon® processors are not supported on the Intel server boards described in this document. Visit the Intel web site for a complete list of supported processors. 3.1.1 Processor Socket Assembly Each processor socket of the server board is pre-assembled with an Independent Latching Mechanism (ILM) and Back Plate which allow for secure placement of the processor and processor heat to the server board. The illustration below identifies each sub-assembly component: Heat Sink Server Board Independent Latching Mechanism (ILM) Back Plate Figure 10. Processor Socket Assembly Revision 1.1 11 Intel order number G24881-004

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Intel® Server Board S2600GZ/GL TPS
Product Architecture Overview
Revision 1.1
Intel order number G24881-004
11
3.1
Processor Support
The server board includes two Socket-R (LGA2011) processor sockets and can support one or
two of the following processors:
Intel
®
Xeon
®
processor E5-2600 product family, with a Thermal Design Power (TDP) of
up to 135W.
Note:
Previous generation Intel
®
Xeon
®
processors are not supported on the Intel server
boards described in this document.
Visit the Intel web site for a complete list of supported processors.
3.1.1
Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching
Mechanism (ILM) and Back Plate which allow for secure placement of the processor and
processor heat to the server board.
The illustration below identifies each sub-assembly component:
Figure 10. Processor Socket Assembly
Heat Sink
Server Board
Independent Latching
Mechanism (ILM)
Back Plate