Intel S2600CP Technical Product Specification - Page 185

Intel® Server Board S2600CP and Server System P4000CP TPS Design and Environmental Specifications 15. Design and Environmental Specifications 15.1 Intel® Server Board S2600CP Design Specifications The following table defines the Intel® Server Board S2600CP operating and non-operating environmental limits. Operation of the Intel® Server Board S2600CP at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability. Table 141. Server Board Design Specifications Note: 1. Operating Temperature Non-Operating Temperature DC Voltage Shock (Unpackaged) Shock (Packaged) < 20 pounds 20 to < 40 pounds 40 to < 80 pounds 80 to < 100 pounds 100 to < 120 pounds 120 pounds Vibration (Unpackaged) 0º C to 55º C 1 (32º F to 131º F) -40º C to 70º C (-40º F to 158º F) ± 5% of all nominal voltages Trapezoidal, 35g, 170 inches/sec 36 inches 30 inches 24 inches 18 inches 12 inches 9 inches 5 Hz to 500 Hz 3.13 g RMS random Chassis design must provide proper airflow to avoid exceeding the processor maximum case temperature. Disclaimer Note: Intel® ensures the unpackaged server board and system meet the shock requirement mentioned above through its own chassis development and system configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and system if the system integrator chooses different system configuration or different chassis. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits. Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel® server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits. Revision 1.2 169 Intel order number G26942-003