Intel S2600CP Technical Product Specification - Page 43

Processor Support - lga2011

Page 43 highlights

Intel® Server Board S2600CP and Server System P4000CP TPS Intel® Server Board S2600CP Functional Architecture 4.1 Processor Support The server board includes two Socket-R (LGA2011) processor sockets and can support two processors from Intel® Xeon® processor E5-2600 product family with a Thermal Design Power (TDP) of up to 135W. Previous generation Intel® Xeon® processors are not supported on the Intel server boards described in this document. Visit the Intel web site for a complete list of supported processors. 4.1.1 Processor Socket Assembly Each processor socket of the server board is pre-assembled with an Independent Latching Mechanism (ILM) and Back Plate which allow for secure placement of the processor and processor heat to the server board. The illustration below identifies each sub-assembly component. Heat Sink Server Board Independent Latching Mechanism (ILM) Back Plate Figure 20. Processor Socket Assembly 4.1.2 Processor Population Rules Note: Although the server board does support dual-processor configurations consisting of different processors that meet the defined criteria below, Intel does not perform validation testing of this configuration. For optimal system performance in dual-processor configurations, Intel recommends that identical processors be installed. When using a single processor configuration, the processor must be installed into the processor socket labeled CPU1. When two processors are installed, the following population rules apply: Revision 1.2 27 Intel order number G26942-003

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Intel
®
Server Board S2600CP and Server System P4000CP TPS
Intel® Server Board S2600CP Functional Architecture
Revision 1.2
Intel order number G26942-003
27
4.1
Processor Support
The server board includes two Socket-R (LGA2011) processor sockets and can support two
processors from Intel
®
Xeon
®
processor E5-2600 product family with a Thermal Design Power
(TDP) of up to 135W
.
Previous generation Intel
®
Xeon
®
processors are not supported on the Intel server boards
described in this document.
Visit the Intel web site for a complete list of supported processors.
4.1.1
Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching
Mechanism (ILM) and Back Plate which allow for secure placement of the processor and
processor heat to the server board.
The illustration below identifies each sub-assembly component.
Figure 20. Processor Socket Assembly
4.1.2
Processor Population Rules
Note:
Although the server board does support dual-processor configurations consisting of
different processors that meet the defined criteria below, Intel does not perform validation
testing of this configuration.
For optimal system performance in dual-processor configurations,
Intel recommends that identical processors be installed.
When using a single processor configuration, the processor must be installed into the processor
socket labeled CPU1.
When two processors are installed, the following population rules apply:
Heat Sink
Server Board
Independent Latching
Mechanism (ILM)
Back Plate