Intel S2600CP Technical Product Specification - Page 211
Intel, Server Board S2600CP and Server System P4000CP TPS, Appendix D: Platform Specific BMC
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Intel® Server Board S2600CP and Server System P4000CP TPS Appendix D: Platform Specific BMC Appendix Chassis P4208XXM/ P4308XXM/ P4216XXM (Redundant fans, redundant PSUs) Revision 1.2 Fan Domain 0 1 2 3 4 Major Components Cooled (Temperature sensor number) Memory channels E and F(B2h) Memory channels G and H(B3h) BB P2 VR Temp(24h) Memory VR(25h) Hot-swap backplane 1(29h) Hot-swap backplane 2(2Ah) BMC Temp(23h) Memory VR(25h) Baseboard NIC(2Fh) Server South Bridge(22h) Hot-swap backplane 1(29h) Hot-swap backplane 2(2Ah) P1 Therm Margin(74h) P2 Therm Margin(75h) Memory channels C and D(B1h) Memory channels E and F(B2h) BMC Temp(23h) Memory VR(25h) Baseboard NIC(2Fh) Server South Bridge(22h) Hot-swap backplane 1(29h) Hot-swap backplane 2(2Ah) P1 Therm Margin(74h) P2 Therm Margin(75h) Memory channels A and B(B0h) Memory channels C and D(B1h) Memory channels E and F(B2h) Memory channels G and H(B3h) BB P2 VR Temp(24h) Memory VR(25h) Hot-swap backplane 1(29h) Hot-swap backplane 2(2Ah) P1 Therm Margin(74h) P2 Therm Margin(75h) Memory channels A and B(B0h) Memory channels C and D(B1h) Memory channels E and F(B2h) Memory channels G and H(B3h) BB P2 VR Temp(24h) Memory VR(25h) Hot-swap backplane 1(29h) Hot-swap backplane 2(2Ah) P2 Therm Margin(75h) Memory channels A and B(B0h) Memory channels G and H(B3h) BB P2 VR Temp(24h) Intel order number G26942-003 Fans (Sensor number) System Fan 1 (30h) System Fan 2 (31h) System Fan 3 (32h) System Fan 4 (33h) System Fan 5 (34h) 195