Intel S2600CP Technical Product Specification - Page 187

Intel® Server Board S2600CP and Server System P4000CP TPS Design and Environmental Specifications electrical and/or thermal stress and for device maturity. You should view MTBF estimates as "reference numbers" only.  Calculation Model: Telcordia* Issue 2, method I case 3  Operating Temperature: Server in 40° C ambient air  Operating Environment: Ground Benign, Controlled  Duty Cycle: 100%  Quality Level: II Table 143. MTBF Estimate Assembly Mother board Integrated Circuits Transistor_Bipolar Transistor_MOSFET Diodes Diodes_LED Resistors Capacitors E-Cap Inductors Connections Misc Failure Rate 4,617.71 1,756.55 6.04 418.11 20.26 90.09 960.02 213.71 571.98 109.62 623.35 73.08 MTBF 216,557 569,298 165,508,840 2,391,663 49,353,370 11,099,561 1,041,635 4,679,143 1,748,312 9,122,408 1,604,218 13,682,860 15.4 Server Board Power Distribution This section provides power supply design guidelines for a system using the Intel® Server Board S2600CP. The following diagram shows the power distribution implemented on these server boards. For power supply data, please refer to the chapter that describe the power system options including 550W or 750W power supply. Please note the intent of 550W/750W power supply data is to provide customers with a guide to assist in defining and/or selecting a power supply for custom server platform designs that utilize the server boards detailed in this document. Revision 1.2 171 Intel order number G26942-003