IBM x3655 Service Guide - Page 108
Removing, heat-sink, retention, module
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Attention: Do not touch the thermal grease on the bottom of the heat sink or set down the heat sink after the plastic cover is removed. Touching the thermal grease will contaminate it. Thermal grease Heat sink a. Make sure that the heat-sink release lever is in the open position. b. Remove the plastic protective cover from the bottom of the heat sink. c. Align the heat sink above the microprocessor with the thermal grease side down. Press firmly on the heat sink. Retainer bracket Heat sink release lever Microprocessor d. Slide the rear flange of the heat sink into the opening in the retainer bracket. e. Press down firmly on the front of the heat sink until it is seated securely. f. Rotate the heat-sink release lever to the closed position and hook it underneath the lock tab. 6. Install the air baffle (see "Installing the air baffle" on page 42). 7. Install the riser-card assembly (see "Installing the riser-card assembly" on page 85). 8. Install the cover (see "Installing the cover" on page 40). 9. Slide the server into the rack. 10. Connect the cables and power cords. 11. Turn on all attached devices and the server. Removing a heat-sink retention module To remove a heat-sink retention module, complete the following steps: 1. Read the safety information that begins on page vii, and "Installation guidelines" on page 35. 2. Turn off the server, and all attached devices. 90 IBM System x3655 Type 7985: Problem Determination and Service Guide
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