Intel SE7525GP2 Product Specification - Page 13
Introduction - server
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Intel® Server Boards SE7320SP2 and SE7525GP2 Introduction 1. Introduction This Technical Product Specification (TPS) provides detail to the architecture and feature set of the Intel® Server Board SE7320SP2 and the Intel® Server Board SE7525GP2. Unless otherwise noted, features discussed in this document apply to both server boards. The target audience for this document is anyone wishing to obtain more in depth detail of the server board than what is generally made available in the board's Users Guide. It is a technical document meant to assist people with understanding and learning more about the specific features of the board. 1.1 Chapter Outline This document is divided into the following chapters Chapter 1: Introduction Chapter 2: Server Board Overview Chapter 3: Functional Architecture Chapter 4: System BIOS Chapter 5: Platform Management Chapter 6: Error Reporting and Handling Chapter 7: Connector Definitions and Pin-outs Chapter 8: General Specifications Chapter 9: Product Regulatory Compliance 1.2 Server Board Use Disclaimer Intel Corporation server boards contain a number of high-density VLSI and power delivery components which need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation can not be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Revision 4.0 1