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General Specifications

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Intel® Server Boards SE7320SP2 and SE7525GP2 General Specifications 8. General Specifications 8.1 Absolute Maximum Ratings Operating either server board at conditions beyond those shown in the following table may cause permanent damage to the system. The table is provided for stress testing purposes only. Exposure to absolute maximum rating conditions for extended periods may affect system reliability. Table 99. Absolute Maximum Ratings Operating Temperature 0 degrees C to 55 degrees C Non-operating Temperature -40 degrees C to +70 degrees C Voltage on any signal with respect to ground -0.3 V to Vdd + 0.3V 3.3 V Supply Voltage with Respect to ground -0.3 V to 3.63 V 5 V Supply Voltage with Respect to ground -0.3 V to 5.5 V Notes: Chassis design must provide proper airflow to avoid exceeding Intel® Xeon® processor maximum case temperature. VDD means supply voltage for the device Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components which need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation can not be held responsible, if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. 8.2 Mean Time Between Failure (MTBF) Intel has calculated the MTBF for the server boards as follows: Table 100. MTBF Calculation Ambient Temperature MTBF Calculation 55° C 97,164 40° C 108,598 Revision 4.0 161

Section	Page
1. Introduction	13
1.1 Chapter Outline	13
1.2 Server Board Use Disclaimer	13
2. Server Board Overview	14
2.1 Intel® Server Board SE7320SP2	14
2.1.1 Intel® Server Board SE7320SP2 Feature Set	14
2.2 Intel® Server Board SE7525GP2	16
2.2.1 Intel® Server Board SE7525GP2 Feature Set	16
3. Functional Architecture	20
3.1 Processor Sub-system	21
3.1.1 Processor Voltage Regulator Devices (VRDs)	22
3.1.2 Reset Configuration Logic	22
3.1.3 Processor Module Presence Detection	22
3.1.4 GTL2006	22
3.1.5 Common Enabling Kit (CEK) Design Support	23
3.1.6 Processor Support	24
3.1.6.1 Processor Mis-population Detection	24
3.1.6.2 Mixed Processor Steppings	25
3.1.6.3 Mixed Processor Models	25
3.1.6.4 Mixed Processor Families	25
3.1.6.5 Mixed Processor Cache Sizes	25
3.1.6.6 Jumperless Processor Speed Settings	25
3.1.6.7 Microcode	25
3.1.6.8 Processor Cache	25
3.1.6.9 Hyper-Threading Technology	26
3.1.6.10 Intel SpeedStep® Technology	26
3.1.6.11 Intel® Extended Memory 64 Technology (Intel® EM64T) Support	26
3.1.6.12 Execute Disable Bit support	26
3.1.7 Multiple Processor Initialization	26
3.1.8 CPU Thermal Sensors	27
3.1.9 Processor Thermal Control Sensor	27
3.1.10 Processor Thermal Trip Shutdown	27
3.1.11 Processor IERR	27
3.2 Intel® E7320 Chipset (Intel® Server Board SE7320SP2)	27
3.2.1 Memory Controller Hub (MCH)	28
3.2.1.1 Front Side Bus (FSB)	28
3.2.1.2 MCH Memory Sub-System Overview	28
3.2.1.3 PCI Express*	29
3.2.1.4 Hub Interface	29
3.3 Intel® E7525 Chipset (Intel® Server Board SE7525GP2)	29
3.3.1 Memory Controller Hub (MCH)	30
3.3.1.1 Front Side Bus (FSB)	30
3.3.1.2 MCH Memory Sub-System Overview	30
3.3.1.3 PCI Express*	31
3.3.1.4 Hub Interface	31
3.4 Intel® 6300ESB ICH	31
3.4.1 PCI Interface	32
3.4.2 IDE Interface (Bus Master Capability and Synchronous DMA Mode)	32
3.4.3 SATA Controller	32
3.4.4 Low Pin Count (LPC) Interface	32
3.4.5 Compatibility Modules (DMA Controller, Timer/Counters, Interrupt Controller)	32
3.4.6 Advanced Programmable Interrupt Controller (APIC)	33
3.4.7 Universal Serial Bus (USB) Controller	33
3.4.8 RTC	33
3.4.9 GPIO	33
3.4.10 Enhanced Power Management	34
3.4.11 System Management Bus (SMBus 2.0)	34
3.5 Memory Sub-System	34
3.5.1 Memory Sizing	34
3.5.2 Memory Population	35
3.5.3 I2C Bus	37
3.5.4 Disabling DIMMs	38
3.5.4.1 Mechanism for CME/SEC Counter	38
3.5.5 Memory RASUM Features	39
3.5.5.1 DRAM ECC – Intel® x4 Single Device Data Correction (x4 SDDC)	40
3.5.5.2 Integrated Memory Scrub Engine	40
3.5.5.3 Retry on Uncorrectable Error	40
3.5.5.4 Integrated Memory Initialization Engine	41
3.5.5.5 DIMM Sparing Function	41
3.6 I/O Sub-System	42
3.6.1 PCI Subsystem	42
3.6.1.1 P32-A: 32-bit, 33-MHz PCI Subsystem	42
3.6.1.2 P64-A: 64-bit, 66 MHz PCI Subsystem	43
3.6.1.3 P64-Express4: x4 PCI Express* Bus Segment	43
3.6.1.4 P64-Express16: x16 PCI Express bus segment	43
3.6.1.5 Scan Order	43
3.6.1.6 Resource Assignment	43
3.6.1.7 Automatic IRQ Assignment	43
3.6.1.8 Option ROM Support	43
3.6.1.9 PCI APIs	44
3.6.2 Split Option ROM	44
3.6.3 Interrupt Routing	44
3.6.3.1 Legacy Interrupt Routing	44
3.6.3.2 APIC Interrupt Routing	44
3.6.3.3 Legacy Interrupt Sources	45
3.6.3.4 Serialized IRQ Support	45
3.6.3.5 IRQ Scan for PCI IRQ	45
3.6.4 IDE Support	48
3.6.4.1 Ultra ATA/100	48
3.6.4.2 IDE Initialization	48
3.6.5 SATA Support	48
3.6.5.1 SATA RAID	49
3.6.5.2 Intel® RAID Technology Option ROM	49
3.6.6 Video Controller	49
3.6.6.1 Video Modes	50
3.6.6.2 Video Memory Interface	50
3.6.7 Network Interface Controller (NIC)	51
3.6.7.1 Intel® 82541	51
3.6.7.2 NIC Connector and Status LEDs	51
3.6.8 USB 2.0 Support	52
3.6.9 Super I/O Chip	52
3.6.9.1 GPIOs	53
3.6.9.2 Serial Ports	54
3.6.9.3 Floppy Disk Controller	54
3.6.9.4 Keyboard and Mouse	54
3.6.9.5 Wake-up Control	54
3.6.10 BIOS Flash	55
3.7 Configuration and Initialization	55
3.7.1 Memory Space	55
3.7.1.1 DOS Compatibility Region	57
3.7.1.2 Extended Memory	59
3.7.1.3 Memory Shadowing	60
3.7.1.4 System Management Mode Handling	61
3.7.2 I/O Map	62
3.7.3 Accessing Configuration Space	64
3.7.3.1 CONFIG_ADDRESS Register	65
3.7.3.1.1 Bus Number	65
3.7.3.1.2 Device Number and IDSEL Mapping	65
3.8 Clock Generation and Distribution	67
3.8.1 Real Time Clock	67
4. System BIOS	68
4.1 BIOS Identification String	68
4.2 BIOS POST Splash Screen	69
4.2.1 User Interface	69
4.2.1.1 System State Window	70
4.2.1.2 Logo/Diagnostic Window	70
4.2.1.3 Current Activity Window	70
4.2.1.4 System Diagnostic Screen	70
4.2.1.5 Static Information Display	70
4.2.1.5.1 Quiet Boot / OEM Splash Screen	71
4.2.1.5.2 BIOS Boot Popup Menu	71
4.3 BIOS Setup Utility	72
4.3.1 Localization	72
4.3.2 Console Redirection	72
4.3.3 Configuration Reset	72
4.3.4 Keyboard Commands	73
4.4 Entering BIOS Setup	74
4.4.1 Main Menu	74
4.4.2 Advanced Menu	75
4.4.2.1 Processor Configuration Sub-menu	75
4.4.2.2 IDE Configuration Sub-menu	77
4.4.2.3 Floppy Configuration Sub-menu	80
4.4.2.4 Super I/O Configuration Sub-menu	81
4.4.2.5 USB Configuration Sub-menu	81
4.4.2.6 USB Mass Storage Device Configuration Sub-menu	82
4.4.2.7 PCI Configuration Sub-menu	83
4.4.2.8 Memory Configuration Sub-menu	84
4.4.3 Boot Menu	85
4.4.3.1 Boot Settings Configuration Sub-menu Selections	85
4.4.3.2 Boot Device Priority Sub-menu Selections	86
4.4.3.2.1 Hard Disk Drive Sub-menu Selections	86
4.4.3.2.2 Removable Drive Sub-menu Selections	86
4.4.3.2.3 ATAPI CD-ROM Drives Sub-menu Selections	87
4.4.4 Security Menu	87
4.4.5 Server Menu	88
4.4.5.1 System Management Sub-menu Selections	90
4.4.5.2 Power Management Features Sub-menu Selections	90
4.4.5.3 Serial Console Features Sub-menu Selections	91
4.4.5.4 Event Log Configuration Sub-menu Selections	92
4.4.6 Exit Menu	93
4.5 Flash Update Utility	93
4.6 Rolling BIOS and On-line Updates	93
4.7 Flash Update Utility	94
4.7.1 Flash BIOS	94
4.7.1.1 Updating the BIOS from DOS	95
4.7.1.2 Updating the BIOS from Microsoft* Windows* 2000/2003/XP	95
4.7.1.3 Updating the BIOS from Linux	95
4.7.1.4 Updating the BIOS from the EFI Shell	96
4.7.2 User Binary Area	96
4.7.3 Recovery Mode	96
4.7.3.1 BIOS Recovery	97
4.7.3.2 Multi-disk Recovery	98
4.7.4 Update OEM Logo	98
4.7.4.1 Changing the OEM Logo for DOS	99
4.7.4.2 Changing the OEM Logo for Microsoft Windows* 2000 / 2003 / XP	99
4.8 OEM Binary	100
4.9 Operating System Boot, Sleep, and Wake	101
4.9.1 Microsoft Windows* Compatibility	101
4.9.2 Advanced Configuration and Power Interface (ACPI)	101
4.9.3 Sleep and Wake Functionality	102
4.9.4 Power Switch Off to On	102
4.9.5 On to Off (OS absent)	103
4.9.6 On to Off (OS present)	103
4.9.7 System Sleep States	103
4.10 Security	104
4.10.1 Operating Model	105
4.10.2 Administrator/User Passwords and F2 Setup Usage Model	105
4.10.3 Password Clear Jumper	107
4.11 Extensible Firmware Interface (EFI)	107
4.11.1 EFI Shell	107
5. Platform Management	107
5.1.1 5V Standby	109
5.1.2 IPMI Messaging, Commands, and Abstractions	109
5.1.3 IPMI Sensor Model	110
5.1.4 Private Management Buses	110
5.1.5 Mini-Baseboard Management Controller	111
5.2 Onboard Platform Instrumentation Features and Functionality	113
5.2.1 mBMC Self-test	114
5.2.2 SMBus Interfaces	114
5.2.3 External Interface to mBMC	114
5.2.3.1 Private Management I2C Buses	115
5.2.4 Messaging Interfaces	115
5.2.4.1 Channel Management	115
5.2.4.2 User Model	115
5.2.4.3 Request/Response Protocol	115
5.2.4.4 Host to mBMC Communication Interface	116
5.2.4.5 LAN Interface	116
5.2.5 Direct Platform Control (IPMI over LAN)	117
5.2.5.1 LAN Channel Specifications	118
5.2.5.2 LAN Drivers and Setup	119
5.2.5.3 BIOS Boot Flags	119
5.2.5.4 Boot Flags and LAN Console Redirection	119
5.2.6 Wake On LAN / Power On LAN and Magic Packet Support	119
5.2.6.1 Wake On LAN in S4/S5	119
5.2.7 Watchdog Timer	120
5.2.8 System Event Log (SEL)	120
5.2.8.1 Timestamp Clock	120
5.2.9 Sensor Data Record (SDR) Repository	121
5.2.9.1 Initialization Agent	121
5.2.10 Event Message Reception	121
5.2.11 Event Filtering and Alerting	121
5.2.11.1 Platform Event Filtering (PEF)	121
5.2.11.2 Alert over LAN	123
5.2.11.3 System Identification in Alerts	123
5.2.11.4 Platform Alerting Setup	123
5.2.11.5 Alerting On Power Down Events	124
5.2.11.6 Alerting On System Reset Events	124
5.2.11.7 Alert-in-Progress Termination	124
5.2.12 NMI Generation	124
5.2.13 SMI Generation	125
5.3 Platform Management Interconnects	125
5.3.1 Power Supply Interface Signals	125
5.3.1.1 Power-up Sequence	126
5.3.1.2 Power-down Sequence	126
5.3.1.3 Power Control Sources	126
5.3.2 System Reset Control	127
5.3.2.1 Reset Signal Output	127
5.3.2.2 Reset Control Sources	127
5.3.3 Temperature-based Fan Speed Control	127
5.3.3.1 Fan Kick-start	128
5.3.4 Front Panel Control	128
5.3.4.1 Power Button	128
5.3.4.2 Reset Button	129
5.3.4.3 Diagnostic Interrupt Button (Front Panel NMI)	129
5.3.4.4 Chassis ID Button and LED	129
5.3.4.5 Status/Fault LED	130
5.3.4.6 Chassis Intrusion Switch	131
5.3.4.7 Front Panel Lockout	131
5.3.5 Secure Mode Operation	131
5.3.6 FRU Information	132
5.3.6.1 mBMC FRU Inventory Area Format	132
5.4 Sensors	133
5.4.1 Sensor Type Codes	133
6. Error Reporting and Handling	138
6.1 Error Logging	138
6.1.1 Error Sources and Types	138
6.1.2 SMI Handler	138
6.1.2.1 PCI Bus Error	138
6.1.2.2 Processor Bus Error	139
6.1.2.3 Memory Bus Error	139
6.1.2.4 System Limit Error	139
6.1.2.5 Processor Failure	139
6.1.2.6 Boot Event	140
6.1.2.7 Logging Format Conventions	140
6.1.3 Single-bit ECC Error Throttling Prevention	140
6.2 Error Messages and Error Codes	141
6.2.1 POST Error Codes and Messages	141
6.2.2 Boot Block Error Beep Codes	144
6.2.3 POST Error Beep Codes	144
6.2.3.1 Troubleshooting BIOS Beep Codes	144
6.2.4 \	145
6.3 Checkpoints	145
6.3.1 System ROM BIOS POST Task Test Point (Port 80h Code)	145
6.3.2 Diagnostic LEDs	145
6.3.3 POST Code Checkpoints	147
6.3.4 Bootblock Initialization Code Checkpoints	149
6.3.5 Bootblock Recovery Code Checkpoint	150
6.3.6 DIM Code Checkpoints	151
6.3.7 ACPI Runtime Checkpoints	151
6.3.8 Memory Error Codes	152
6.4 Intel® Light-Guided Diagnostics	152
7. Connector Definitions and Pin-outs	153
7.1 Main Power Connector	153
7.2 Memory Module Connector	154
7.3 Processor Socket	155
7.4 I2C Headers	158
7.5 PCI Slot Connector	159
7.6 Front Panel Connector	163
7.7 VGA Connector	164
7.8 NIC Connector	164
7.9 IDE Connector	165
7.10 SATA Connectors	165
7.11 USB Connector	166
7.12 Floppy Connector	167
7.13 Serial Port Connector	168
7.14 Keyboard and Mouse Connector	169
7.15 Miscellaneous Headers	169
7.15.1 Fan Header	169
7.15.2 Intrusion Cable Connector	170
7.15.3 SCSI LED Header	170
7.16 Configuration Jumpers	171
7.16.1 System Recovery and Update Jumpers	171
7.16.2 Rolling BIOS Bank Selection Jumper	172
8. General Specifications	173
8.1 Absolute Maximum Ratings	173
8.2 Mean Time Between Failure (MTBF)	173
8.3 Processor Power Support	174
8.4 Power Supply Specifications	174
8.4.1 Power Timing	174
8.4.2 Voltage Recovery Timing Specifications	178
9. Product Regulatory Compliance	179
9.1 Product Safety Compliance	179
9.1.1 Product EMC Compliance	179
9.1.2 Mandatory/Standard: Certifications, Registration, Declarations	180
9.1.3 Product Regulatory Compliance Markings	180
9.2 Electromagnetic Compatibility Notices	180
9.2.1 Europe (CE Declaration of Conformity)	180
9.2.2 Australian Communications Authority (ACA) (C-Tick Declaration of Conformity)	180
9.2.3 Ministry of Economic Development (New Zealand) Declaration of Conformity	181
9.2.4 BSMI (Taiwan)	181

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Intel® Server Boards SE7320SP2 and SE7525GP2

General Specifications

Revision 4.0

161

General Specifications

8.1

Absolute Maximum Ratings

Operating either server board at conditions beyond those shown in the following table may

cause permanent damage to the system. The table is provided for stress testing purposes only.

Exposure to absolute maximum rating conditions for extended periods may affect system

reliability.

Table 99. Absolute Maximum Ratings

Operating Temperature

0 degrees C to 55 degrees C

Non-operating Temperature

-40 degrees C to +70 degrees C

Voltage on any signal with respect to ground

-0.3 V to Vdd + 0.3V

3.3 V Supply Voltage with Respect to ground

-0.3 V to 3.63 V

5 V Supply Voltage with Respect to ground

-0.3 V to 5.5 V

Notes:

Chassis design must provide proper airflow to avoid exceeding Intel

Xeon

processor maximum case temperature.

VDD means supply voltage for the device

Note:

Intel Corporation server boards contain a number of high-density VLSI and power delivery

components which need adequate airflow to cool. Intel ensures through its own chassis

development and testing that when Intel server building blocks are used together, the fully

integrated system will meet the intended thermal requirements of these components. It is the

responsibility of the system integrator who chooses not to use Intel developed server building

blocks to consult vendor datasheets and operating parameters to determine the amount of air

flow required for their specific application and environmental conditions. Intel Corporation can

not be held responsible, if components fail or the server board does not operate correctly when

used outside any of their published operating or non-operating limits.

8.2

Mean Time Between Failure (MTBF)

Intel has calculated the MTBF for the server boards as follows:

Table 100. MTBF Calculation

Ambient Temperature

MTBF Calculation

55° C

97,164

40° C

108,598