HP Designjet L28500 HP Designjet L28500 Printer Series - User's guide - Page 68

Substrat e family Warmup drying tempera ture offset Warmup curing tempera ture Warmup curing tempera ture offset Cooldown drying tempera ture Cooldown drying tempera ture offset Cooldown curing tempera ture Cooldown curing tempera ture offset Minimu m drying power Low temp 5 80 0 75 0 85 0 0 (incl. HP Photoreal) Mesh 5 85 0 80 0 95 0 0.7 Interpass drying time 0 0 The various settings mentioned above are described below. Setting Warm-up drying temperature Warm-up drying temperature offset Warm-up curing temperature Warm-up curing temperature offset Cool-down drying temperature Cool-down drying temperature offset Cool-down curing temperature Cool-down curing temperature offset Description If too low If too high The base temperature that the substrate in the print zone must reach before printing starts. This setting is determined by the RIP. You cannot change it. This offset is added to the base warm-up drying temperature, and the total is displayed in the front panel while the printer is preparing to print. Bleeding or coalescence may appear in the first 200-300 mm of the print. A longer time to start printing is required. Vertical banding or ink smears may occur. The base temperature that the substrate in the curing zone must reach before printing starts. This setting is determined by the printer. You cannot change it. This offset is added to the base warm-up curing temperature, and the total is displayed in the front panel while the printer is preparing to print. The beginning of the print is not fully dry, or looks oily. Substrate degradation (blisters, adhesive detachment) at the beginning of the print. The base temperature at which the substrate can be under the drying module without being damaged. At the end of a job, the substrate is not stopped until this temperature is reached. This setting is determined by the printer. You cannot change it. This offset is added to the base cool-down drying temperature. A long time is needed to finish the print. The substrate at the beginning of the next print may be damaged, because it has stopped moving under too high a temperature. This case is uncommon. The base temperature at which the substrate can be under the curing module without being damaged. At the end of a job, the substrate is not stopped until this temperature is reached. This setting is determined by the printer. You cannot change it. This offset is added to the base cool-down curing temperature. A long time is needed to finish the print. The end of the print may be damaged if the cutter is disabled. 62 Chapter 5 Substrate settings ENWW