AMD AMD-K6-2/400 User Guide - Page 21
Package Specifications on provides, functional grouping. - 333
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23542A/0-September 2000 Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet Chapter 17, "Thermal Design" on page 313, lists the package thermal specifications, discusses how to measure case temperature, and provides layout and airflow considerations. Chapter 18, "Pin Designations" on page 321, provides top- and bottom-view connection diagrams for each package type and lists the AMD-K6-2E+ processor's pin designations by functional grouping. Chapter 19, "Package Specifications" on page 331, provides diagrams showing the specifications for the 321-pin CPGA package and the 349-ball OBGA package. Chapter 20, "Ordering Information" on page 333, provides the ordering part number (OPN) and valid OPN combinations. About this Data Sheet xxi