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Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet 23542A/0-September 2000 Table 58. DC Characteristics for the AMD-K6™-2E+ Processor (continued) Symbol Parameter Description ICC2 Standard 2.0 V Power Supply Current Power ICC3 Standard and Low Power 3.3 V Power Supply Current ILI7 ILO7 IIL8 IIH9 CIN COUT COUT CCLK CTIN CTOUT CTCK Input Leakage Current Output Leakage Current Input Leakage Current Bias with Pullup Input Leakage Current Bias with Pulldown Input Capacitance Output Capacitance I/O Capacitance CLK Capacitance Test Input Capacitance (TDI, TMS, TRST#) Test Output Capacitance (TDO) TCK Capacitance Preliminary Data Min Max 8.70 A 9.25 A 9.75 A 0.64 A 0.65 A 0.66 A 0.68 A –15 mA –15 mA -500 mA 500 mA 10 pF 15 pF 20 pF 10 pF 10 pF 15 pF 10 pF Comments 400 MHz3,4,5 450 MHz3,5 500 MHz3,5 350 MHz3,6 400 MHz3,4,6 450 MHz3,6 500 MHz3,6 Notes: 1. VCC3 refers to the voltage being applied to VCC3 during functional operation. 2. VCC2 = Maximum VCC2 as listed in Table 55 on page 286- The maximum power supply current must be taken into account when designing a power supply. 3. This specification applies to components using a CLK frequency of 100 MHz. 4. This specification applies to components using a CLK frequency of 66 MHz (66-MHz bus applies to 400-MHz part only). 5. VCC2 = 2.1 V - The maximum power supply current must be taken into account when designing a power supply. 6. VCC3 = 3.6 V-The maximum power supply current must be taken into account when designing a power supply. 7. Refers to inputs and I/O without an internal pullup resistor and 0 ˆ VIN ˆ VCC3. 8. Refers to inputs with an internal pullup and VIL = 0.4 V. 9. Refers to inputs with an internal pulldown and VIH = 2.4 V. 288 Electrical Data Chapter 15

Section	Page
IF YOU HAVE QUESTIONS, WE\	3
Contents	5
List of Figures	9
List of Tables	13
Revision History	17
About this Data Sheet	19
1 AMDK6™2E+ Embedded Processor	23
1.1 AMDK6™2E+ Embedded Processor Features	25
1.2 Process Technology	29
1.3 Super7™ Platform	30
2 Internal Architecture	33
2.1 Microarchitecture Overview	33
2.2 Cache, Instruction Prefetch, and Predecode Bits	38
2.3 Instruction Fetch and Decode	39
2.4 Centralized Scheduler	43
2.5 Execution Units	44
2.6 BranchPrediction Logic	47
3 Software Environment	49
3.1 Registers	49
3.2 ModelSpecific Registers (MSR)	66
3.3 Memory Management Registers	76
3.4 Paging	78
3.5 Descriptors and Gates	81
3.6 Exceptions and Interrupts	84
3.7 Instructions Supported by the AMDK6™2E+ Processor	85
4 Logic Symbol Diagram	113
5 Signal Descriptions	115
5.1 Signal Terminology	115
5.2 A20M# (Address Bit 20 Mask)	116
5.3 A[31:3] (Address Bus)	117
5.4 ADS# (Address Strobe)	118
5.5 ADSC# (Address Strobe Copy)	118
5.6 AHOLD (Address Hold)	119
5.7 AP (Address Parity)	120
5.8 APCHK# (Address Parity Check)	121
5.9 BE[7:0]# (Byte Enables)	122
5.10 BF[2:0] (Bus Frequency)	123
5.11 BOFF# (Backoff)	124
5.12 BRDY# (Burst Ready)	125
5.13 BRDYC# (Burst Ready Copy)	126
5.14 BREQ (Bus Request)	126
5.15 CACHE# (Cacheable Access)	127
5.16 CLK (Clock)	127
5.17 D/C# (Data/Code)	128
5.18 D[63:0] (Data Bus)	129
5.19 DP[7:0] (Data Parity)	130
5.20 EADS# (External Address Strobe)	131
5.21 EWBE# (External Write Buffer Empty)	132
5.22 FERR# (FloatingPoint Error)	133
5.23 FLUSH# (Cache Flush)	134
5.24 HIT# (Inquire Cycle Hit)	135
5.25 HITM# (Inquire Cycle Hit To Modified Line)	135
5.26 HLDA (Hold Acknowledge)	136
5.27 HOLD (Bus Hold Request)	137
5.28 IGNNE# (Ignore Numeric Exception)	138
5.29 INIT (Initialization)	139
5.30 INTR (Maskable Interrupt)	140
5.31 INV (Invalidation Request)	140
5.32 KEN# (Cache Enable)	141
5.33 LOCK# (Bus Lock)	142
5.34 M/IO# (Memory or I/O)	143
5.35 NA# (Next Address)	144
5.36 NMI (NonMaskable Interrupt)	145
5.37 PCD (Page Cache Disable)	146
5.38 PCHK# (Parity Check)	147
5.39 PWT (Page Writethrough)	148
5.40 RESET (Reset)	149
5.41 RSVD (Reserved)	150
5.42 SCYC (Split Cycle)	151
5.43 SMI# (System Management Interrupt)	152
5.44 SMIACT# (System Management Interrupt Active)	153
5.45 STPCLK# (Stop Clock)	154
5.46 TCK (Test Clock)	155
5.47 TDI (Test Data Input)	155
5.48 TDO (Test Data Output)	155
5.49 TMS (Test Mode Select)	156
5.50 TRST# (Test Reset)	156
5.51 VCC2DET (VCC2 Detect)	157
5.52 VCC2H/L# (VCC2 High/Low)	158
5.53 VID[4:0] (Voltage Identification)	159
5.54 W/R# (Write/Read)	160
5.55 WB/WT# (Writeback or Writethrough)	161
5.56 Pin Tables by Type	162
5.57 Bus Cycle Definitions	164
6 AMD PowerNow!™ Technology	165
6.1 Enhanced Power Management Features	165
6.2 Dynamic Core Frequency and Core Voltage Control	172
7 Bus Cycles	175
7.1 Timing Diagrams	175
7.2 Bus States	177
7.3 Memory Reads and Writes	180
7.4 I/O Read and Write	188
7.5 Inquire and Bus Arbitration Cycles	190
7.6 Special Bus Cycles	212
8 Poweron Configuration and Initialization	221
8.1 Signals Sampled During the Falling Transition of RESET	221
8.2 RESET Requirements	222
8.3 State of Processor After RESET	222
8.4 State of Processor After INIT	225
9 Cache Organization	227
9.1 MESI States in the L1 Data Cache and L2 Cache	229
9.2 Predecode Bits	230
9.3 Cache Operation	230
9.4 Cache Disabling and Flushing	233
9.5 L2 Cache Testing	235
9.6 CacheLine Fills	235
9.7 CacheLine Replacements	236
9.8 Write Allocate	237
9.9 Prefetching	242
9.10 Cache States	243
9.11 Cache Coherency	244
9.12 Writethrough and Writeback Coherency States	249
9.13 A20M# Masking of Cache Accesses	249
10 Write Merge Buffer	251
10.1 EWBE# Control	251
10.2 Memory Type Range Registers	253
10.3 Memory-Range Restrictions	255
10.4 Examples	257
11 FloatingPoint and Multimedia Execution Units	259
11.1 FloatingPoint Execution Unit	259
11.2 Multimedia and 3DNow!™ Execution Units	261
11.3 FloatingPoint and MMX™/3DNow!™ Instruction Compatibility	262
12 System Management Mode (SMM)	263
12.1 SMM Operating Mode and Default Register Values	263
12.2 SMM StateSave Area	265
12.3 SMM Revision Identifier	267
12.4 SMM Base Address	268
12.5 Halt Restart Slot	268
12.6 I/O Trap Doubleword	269
12.7 I/O Trap Restart Slot	270
12.8 Exceptions, Interrupts, and Debug in SMM	272
13 Test and Debug	273
13.1 BuiltIn SelfTest (BIST)	273
13.2 ThreeState Test Mode	274
13.3 BoundaryScan Test Access Port (TAP)	275
13.4 Cache Inhibit	285
13.5 L2 Cache and Tag Array Testing	286
13.6 Debug	290
14 Clock Control	297
14.1 Clock Control States	297
14.2 Halt State	300
14.3 Stop Grant State	300
14.4 Stop Grant Inquire State	302
14.5 EPM Stop Grant State	303
14.6 Stop Clock State	305
15 Electrical Data	307
15.1 Operating Ranges	308
15.2 Absolute Ratings	309
15.3 DC Characteristics	309
15.4 Power Dissipation	311
15.5 Power and Grounding	313
16 Signal Switching Characteristics	317
16.1 CLK Switching Characteristics	318
16.2 Clock Switching Characteristics for 100MHz Bus Operation	318
16.3 Clock Switching Characteristics for 66MHz Bus Operation	319
16.4 Valid Delay, Float, Setup, and Hold Timings	320
16.5 Output Delay Timings for 100MHz Bus Operation	320
16.6 Input Setup and Hold Timings for 100MHz Bus Operation	322
16.7 Output Delay Timings for 66MHz Bus Operation	324
16.8 Input Setup and Hold Timings for 66MHz Bus Operation	326
16.9 RESET and Test Signal Timing	328
16.10 Timing Diagrams	331
17 Thermal Design	335
17.1 Package Thermal Specifications	335
17.2 Measuring Case Temperature	339
17.3 Layout and Airflow Considerations	339
18 Pin Designations	343
18.1 Pins Designations for CPGA Package	344
18.2 Pins Designations for OBGA Package	348
19 Package Specifications	353
19.1 321Pin Staggered CPGA Package Specification	353
19.2 349Ball OBGA Package Specification	354
20 Ordering Information	355

Match case Limit results 1 per page

288

Electrical Data

Chapter 15

AMD-K6™-2E+ Embedded Processor Data Sheet

23542A/0—September 2000

Preliminary Information

CC2

Standard

Power

2.0 V Power Supply Current

8.70 A

400 MHz

3,4,5

9.25 A

450 MHz

3,5

9.75 A

500 MHz

3,5

CC3

Standard

and Low

Power

3.3 V Power Supply Current

0.64 A

350 MHz

3,6

0.65 A

400 MHz

3,4,6

0.66 A

450 MHz

3,6

0.68 A

500 MHz

3,6

Input Leakage Current

Output Leakage Current

Input Leakage Current Bias with Pullup

–500

Input Leakage Current Bias with Pulldown

500

Input Capacitance

10 pF

OUT

Output Capacitance

15 pF

OUT

I/O Capacitance

20 pF

CLK

CLK Capacitance

10 pF

TIN

Test Input Capacitance (TDI, TMS, TRST#)

10 pF

TOUT

Test Output Capacitance (TDO)

15 pF

TCK

TCK Capacitance

10 pF

Notes:

CC3

refers to the voltage being applied to V

CC3

during functional operation.

CC2

= Maximum V

CC2

as listed in Table 55 on page 286— The maximum power supply current must be taken into account when

designing a power supply.

This specification applies to components using a CLK frequency of 100 MHz.

This specification applies to components using a CLK frequency of 66 MHz (66-MHz bus applies to 400-MHz part only).

CC2

= 2.1 V — The maximum power supply current must be taken into account when designing a power supply.

CC3

= 3.6 V—The maximum power supply current must be taken into account when designing a power supply.

Refers to inputs and I/O without an internal pullup resistor and 0

CC3.

Refers to inputs with an internal pullup and V

= 0.4 V.

Refers to inputs with an internal pulldown and V

= 2.4 V.

Table 58.

DC Characteristic

s for the AMD-K6™-2E+ Processor (continued)

Symbol

Parameter Description

Preliminary Data

Comments

Min

Max