AMD AMD-K6-2/400 User Guide - Page 337
Thermal Design, Thermal Model CPGA Package - power consumption
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23542A/0-September 2000 Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet Temperature (Ambient) Thermal Resistance (°C/W) TCA Sink Case qSA qCA qIF Figure 113. Thermal Model (CPGA Package) Figure 114 illustrates the case-to-ambient temperature (TCA) in relation to the power consumption (X-axis) and the thermal resistance (Y-axis). If the power consumption and case temperature are known, the thermal resistance (qCA) requirement can be calculated for a given ambient temperature (TA) value. CA Thermal Resistance (°C/W) $ #$ # "$ " !$ ! $ q $ %ÃX 'ÃX TCA = TC - TA Case-to-Ambient Temperature (TC - TA) "ÃqrtÃ8 !$ÃqrtÃ8 !ÃqrtÃ8 $ÃqrtÃ8 ÃX !ÃX #ÃX %ÃX 'ÃX Power Consumption (Watts) !ÃX !!ÃX !#ÃX Figure 114. Power Consumption and Thermal Resistance (CPGA Package) Chapter 17 Thermal Design 315