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23542A/0-September 2000 Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet 15.2 Absolute Ratings The AMD-K6-2E+ processor is not designed to be operated beyond the operating ranges listed in Table 55 and Table 56. Exposure to conditions outside these operating ranges for extended periods of time can affect long-term reliability. Permanent damage can occur if the absolute ratings listed in Table 57 are exceeded. Table 57. Absolute Ratings Parameter Description Minimum Maximum VCC2 VCC3 VPIN1 TCASE (under bias) TSTORAGE Core Supply Voltage I/O Supply Voltage Voltage on Any I/O Pin Case Temperature Storage Temperature -0.5 V -0.5 V -0.5 V -65•C -65•C 2.2 V 3.6 V VCC3 + 0.4 V and ˆ 3.8 V +110•C +150•C Notes: 1. VPIN (the voltage on any I/O pin) must not be greater than 0.4 V above the voltage being applied to VCC3. In addition, the VPIN voltage must never exceed 3.8 V. 15.3 DC Characteristics The DC characteristics of the AMD-K6-2E+ processor are shown in Table 58. Table 58. DC Characteristics for the AMD-K6™-2E+ Processor Symbol Parameter Description VIL Input Low Voltage VIH1 Input High Voltage VOL Output Low Voltage VOH Output High Voltage 1.5-V Power Supply Current ICC2 1.6-V Power Supply Current Low Power 1.7-V Power Supply Current Preliminary Data Min -0.3 V Max +0.8 V 2.0 V VCC3+0.3 V 0.4 V 2.4 V 5.30 A 6.15 A 7.60 A Comments IOL = 4.0-mA load IOH = 3.0-mA load 350 MHz2,3 400 MHz2,3,4 450 MHz2,3 Chapter 15 Electrical Data 287

Section	Page
IF YOU HAVE QUESTIONS, WE\	3
Contents	5
List of Figures	9
List of Tables	13
Revision History	17
About this Data Sheet	19
1 AMDK6™2E+ Embedded Processor	23
1.1 AMDK6™2E+ Embedded Processor Features	25
1.2 Process Technology	29
1.3 Super7™ Platform	30
2 Internal Architecture	33
2.1 Microarchitecture Overview	33
2.2 Cache, Instruction Prefetch, and Predecode Bits	38
2.3 Instruction Fetch and Decode	39
2.4 Centralized Scheduler	43
2.5 Execution Units	44
2.6 BranchPrediction Logic	47
3 Software Environment	49
3.1 Registers	49
3.2 ModelSpecific Registers (MSR)	66
3.3 Memory Management Registers	76
3.4 Paging	78
3.5 Descriptors and Gates	81
3.6 Exceptions and Interrupts	84
3.7 Instructions Supported by the AMDK6™2E+ Processor	85
4 Logic Symbol Diagram	113
5 Signal Descriptions	115
5.1 Signal Terminology	115
5.2 A20M# (Address Bit 20 Mask)	116
5.3 A[31:3] (Address Bus)	117
5.4 ADS# (Address Strobe)	118
5.5 ADSC# (Address Strobe Copy)	118
5.6 AHOLD (Address Hold)	119
5.7 AP (Address Parity)	120
5.8 APCHK# (Address Parity Check)	121
5.9 BE[7:0]# (Byte Enables)	122
5.10 BF[2:0] (Bus Frequency)	123
5.11 BOFF# (Backoff)	124
5.12 BRDY# (Burst Ready)	125
5.13 BRDYC# (Burst Ready Copy)	126
5.14 BREQ (Bus Request)	126
5.15 CACHE# (Cacheable Access)	127
5.16 CLK (Clock)	127
5.17 D/C# (Data/Code)	128
5.18 D[63:0] (Data Bus)	129
5.19 DP[7:0] (Data Parity)	130
5.20 EADS# (External Address Strobe)	131
5.21 EWBE# (External Write Buffer Empty)	132
5.22 FERR# (FloatingPoint Error)	133
5.23 FLUSH# (Cache Flush)	134
5.24 HIT# (Inquire Cycle Hit)	135
5.25 HITM# (Inquire Cycle Hit To Modified Line)	135
5.26 HLDA (Hold Acknowledge)	136
5.27 HOLD (Bus Hold Request)	137
5.28 IGNNE# (Ignore Numeric Exception)	138
5.29 INIT (Initialization)	139
5.30 INTR (Maskable Interrupt)	140
5.31 INV (Invalidation Request)	140
5.32 KEN# (Cache Enable)	141
5.33 LOCK# (Bus Lock)	142
5.34 M/IO# (Memory or I/O)	143
5.35 NA# (Next Address)	144
5.36 NMI (NonMaskable Interrupt)	145
5.37 PCD (Page Cache Disable)	146
5.38 PCHK# (Parity Check)	147
5.39 PWT (Page Writethrough)	148
5.40 RESET (Reset)	149
5.41 RSVD (Reserved)	150
5.42 SCYC (Split Cycle)	151
5.43 SMI# (System Management Interrupt)	152
5.44 SMIACT# (System Management Interrupt Active)	153
5.45 STPCLK# (Stop Clock)	154
5.46 TCK (Test Clock)	155
5.47 TDI (Test Data Input)	155
5.48 TDO (Test Data Output)	155
5.49 TMS (Test Mode Select)	156
5.50 TRST# (Test Reset)	156
5.51 VCC2DET (VCC2 Detect)	157
5.52 VCC2H/L# (VCC2 High/Low)	158
5.53 VID[4:0] (Voltage Identification)	159
5.54 W/R# (Write/Read)	160
5.55 WB/WT# (Writeback or Writethrough)	161
5.56 Pin Tables by Type	162
5.57 Bus Cycle Definitions	164
6 AMD PowerNow!™ Technology	165
6.1 Enhanced Power Management Features	165
6.2 Dynamic Core Frequency and Core Voltage Control	172
7 Bus Cycles	175
7.1 Timing Diagrams	175
7.2 Bus States	177
7.3 Memory Reads and Writes	180
7.4 I/O Read and Write	188
7.5 Inquire and Bus Arbitration Cycles	190
7.6 Special Bus Cycles	212
8 Poweron Configuration and Initialization	221
8.1 Signals Sampled During the Falling Transition of RESET	221
8.2 RESET Requirements	222
8.3 State of Processor After RESET	222
8.4 State of Processor After INIT	225
9 Cache Organization	227
9.1 MESI States in the L1 Data Cache and L2 Cache	229
9.2 Predecode Bits	230
9.3 Cache Operation	230
9.4 Cache Disabling and Flushing	233
9.5 L2 Cache Testing	235
9.6 CacheLine Fills	235
9.7 CacheLine Replacements	236
9.8 Write Allocate	237
9.9 Prefetching	242
9.10 Cache States	243
9.11 Cache Coherency	244
9.12 Writethrough and Writeback Coherency States	249
9.13 A20M# Masking of Cache Accesses	249
10 Write Merge Buffer	251
10.1 EWBE# Control	251
10.2 Memory Type Range Registers	253
10.3 Memory-Range Restrictions	255
10.4 Examples	257
11 FloatingPoint and Multimedia Execution Units	259
11.1 FloatingPoint Execution Unit	259
11.2 Multimedia and 3DNow!™ Execution Units	261
11.3 FloatingPoint and MMX™/3DNow!™ Instruction Compatibility	262
12 System Management Mode (SMM)	263
12.1 SMM Operating Mode and Default Register Values	263
12.2 SMM StateSave Area	265
12.3 SMM Revision Identifier	267
12.4 SMM Base Address	268
12.5 Halt Restart Slot	268
12.6 I/O Trap Doubleword	269
12.7 I/O Trap Restart Slot	270
12.8 Exceptions, Interrupts, and Debug in SMM	272
13 Test and Debug	273
13.1 BuiltIn SelfTest (BIST)	273
13.2 ThreeState Test Mode	274
13.3 BoundaryScan Test Access Port (TAP)	275
13.4 Cache Inhibit	285
13.5 L2 Cache and Tag Array Testing	286
13.6 Debug	290
14 Clock Control	297
14.1 Clock Control States	297
14.2 Halt State	300
14.3 Stop Grant State	300
14.4 Stop Grant Inquire State	302
14.5 EPM Stop Grant State	303
14.6 Stop Clock State	305
15 Electrical Data	307
15.1 Operating Ranges	308
15.2 Absolute Ratings	309
15.3 DC Characteristics	309
15.4 Power Dissipation	311
15.5 Power and Grounding	313
16 Signal Switching Characteristics	317
16.1 CLK Switching Characteristics	318
16.2 Clock Switching Characteristics for 100MHz Bus Operation	318
16.3 Clock Switching Characteristics for 66MHz Bus Operation	319
16.4 Valid Delay, Float, Setup, and Hold Timings	320
16.5 Output Delay Timings for 100MHz Bus Operation	320
16.6 Input Setup and Hold Timings for 100MHz Bus Operation	322
16.7 Output Delay Timings for 66MHz Bus Operation	324
16.8 Input Setup and Hold Timings for 66MHz Bus Operation	326
16.9 RESET and Test Signal Timing	328
16.10 Timing Diagrams	331
17 Thermal Design	335
17.1 Package Thermal Specifications	335
17.2 Measuring Case Temperature	339
17.3 Layout and Airflow Considerations	339
18 Pin Designations	343
18.1 Pins Designations for CPGA Package	344
18.2 Pins Designations for OBGA Package	348
19 Package Specifications	353
19.1 321Pin Staggered CPGA Package Specification	353
19.2 349Ball OBGA Package Specification	354
20 Ordering Information	355

Match case Limit results 1 per page

Chapter 15

Electrical Data

287

23542A/0—September 2000

AMD-K6™-2E+ Embedded Processor Data Sheet

Preliminary Information

15.2

Absolute Ratings

The AMD-K6-2E+ processor is not designed to be operated

beyond the operating ranges listed in Table 55 and Table 56.

Exposure to conditions outside these operating ranges for

extended periods of time can affect long-term reliability.

Permanent damage can occur if the absolute ratings listed in

Table 57 are exceeded.

15.3

DC Characteristics

The DC characteristics of the AMD-K6-2E+ processor are shown

in Table 58.

Table 57.

Absolute Ratings

Parameter

Description

Minimum

Maximum

CC2

Core Supply Voltage

–0.5 V

2.2 V

CC3

I/O Supply Voltage

–0.5 V

3.6 V

Notes:

(the voltage on any I/O pin) must not be greater than 0.4 V above the voltage being applied to V

CC3

. In addition, the V

voltage

must never exceed 3.8 V.

Voltage on Any I/O Pin

–0.5 V

CC3

+ 0.4 V and

3.8 V

CASE

(under bias)

Case Temperature

–65

+110

STORAGE

Storage Temperature

–65

+150

Table 58.

DC Characteristic

s for the AMD-K6™-2E+ Processor

Symbol

Parameter Description

Preliminary Data

Comments

Min

Max

Input Low Voltage

–0.3 V

+0.8 V

Input High Voltage

2.0 V

VCC3+0.3 V

Output Low Voltage

0.4 V

= 4.0-mA load

Output High Voltage

2.4 V

= 3.0-mA load

CC2

Low Power

1.5-V Power Supply Current

5.30 A

350 MHz

2,3

1.6-V Power Supply Current

6.15 A

400 MHz

2,3,4

1.7-V Power Supply Current

7.60 A

450 MHz

2,3