Intel VC820 Design Guide - Page 107
Table 3-2. Example T, Calculations for 133 MHz Bus
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Advanced System Bus Design of timing and signal quality margin. The magnitude of MADJ is highly dependent on baseboard design implementation (stackup, decoupling, layout, routing, reference planes, etc.) and needs to be characterized and budgeted appropriately for each design. Table 3-2 and Table 3-3 are derived assuming: • CLKSKEW = 0.2 ns (Note: Assumes clock driver pin-to-pin skew is reduced to 50 ps by tying two host clock outputs together ("ganging") at clock driver output pins, and the PCB clock routing skew is 150 ps. System timing budget must assume 0.175 ns of clock driver skew if outputs are not tied together and a clock driver that meets the CK98 clock driver specification is being used.) • CLKJITTER = 0.250 ns Some clock driver components may not support ganging the outputs together. Be sure to verify with your clock component vendor before ganging the outputs. See the appropriate Intel 820 chipset documentation for details on clock skew and jitter specifications. Refer to Section 2.6.2, "Direct Rambus* Layout Guidelines" on page 2-8 and Chapter 4, "Clocking" for host clock routing details. Table 3-2. Example TFLT_MAX Calculations for 133 MHz Bus1 Driver Processor4 Processor4 82820 MCH Receiver Processor4 82820 MCH Processor4 Clk Period2 7.50 7.50 7.50 TCO_MAX 2.7 2.7 3.63 TSU_MIN 1.20 2.27 1.20 ClkSKEW 0.20 0.20 0.20 ClkJITTER 0.250 0.250 0.25 MAD J 0.40 0.40 0.40 Recommended TFLT_MAX3 2.75 1.68 1.82 NOTES: 1. All times in nanoseconds. 2. BCLK period = 7.50 ns @ 133.33 MHz. 3. The flight times in this column include margin to account for the following phenomena that Intel has observed when multiple bits are switching simultaneously. These multi-bit effects can adversely affect flight time and signal quality and are sometimes not accounted for in simulation. Accordingly, maximum flight times depend on the baseboard design and additional adjustment factors or margins are recommended. - SSO push-out or pull-in. - Rising or falling edge rate degradation at the receiver caused by inductance in the current return path, requiring extrapolation that causes additional delay. - Cross-talk on the PCB and internal to the package can cause variation in the signals. There are additional effects that may not necessarily be covered by the multi-bit adjustment factor and should be budgeted as appropriate to the baseboard design. Examples include: - The effective board propagation constant (SEFF), which is a function of: • Dielectric constant (εr) of the PCB material. • The type of trace connecting the components (stripline or microstrip). • The length of the trace and the load of the components on the trace. Note that the board propagation constant multiplied by the trace length is a component of the flight time but not necessarily equal to the flight time. 4. Processor values specified in this table are examples only. Refer to the appropriate processor datasheet for specification values. Intel®820 Chipset Design Guide 3-7