Intel VC820 Design Guide - Page 239
RIMM Decoupling, Decoupling., ICH Decoupling, MCH Decoupling
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8 7 6 5 4 3 2 1 Decoupling MCH Decoupling ICH Decoupling 82559 Decoupling. RIMM Decoupling C290 C88 C105 C60 C29 C30 C252 C230 C224 C254 C248 C232 C231 C253 C162 C202 C213 C156 C166 C201 C212 C157 D VCC1_8 VCC2_5SBY VCC2_5SBY VCMOS1_8SBY D VCC3_3 VCC3_3SBY C219 C285 C210 C303 C302 C289 C284 C288 C235 C264 C226 0.1UF 0.1UF 0.1UF 0.1UF 0.01UF C258 C229 C227 C222 VCC1_8 0.1UF 0.1UF 0.1UF 0.1UF 0.1UF 0.1UF 0.1UF 0.1UF 0.01UF 0.1UF 0.1UF 0.1UF 0.1UF 4.7UF 100UF 100UF 100UF 100UF 100UF 100UF 100UF 100UF 0.1UF 0.1UF 0.1UF 0.01UF 0.01UF 4.7UF Place a VCMOS1_8SBY 0.1uF cap at each RIMM. 0.01UF Place these caps on solder side 0.01UF C VDDQ 0.01UF 0.01UF 0.1UF Place 100uF caps, 0.1 ohm ESR, among RIMM connectors. C C255 C165 For chipset decoupling, use 0.1UF and 0.01UF decoupling capacitor at each corner of the device. If there is room, add 0.01UF capacitors in the middle of each quad. 0.1UF Place these caps on solder side VCC3_3SBY Un-used Gates VCC3_3SBY C143 C144 C197 C272 C270 C221 VDDQ 0.01UF 0.01UF B 0.01UF 0.01UF 0.01UF 0.01UF Place VDDQ capacitors within 70 mils of outer balls of MCH. A 8 7 VCC3_3SBY U14 VCC 14 9 8 7 GND SN74LVC07A U14 VCC 14 11 10 7 GND SN74LVC07A 6 9 14 U3 8 10 SN74LVC087A 12 14 U3 11 13 SN74LVC087A VCC5SBY U18 74LS1132 14VCC 3 2 7 GND U18 74LS11232 14VCC 11 13 7 GND 5 4 U15 14 11 10 74LVC14A7 U15 14 13 12 74LVC14A7 VCC3_3SBY U20 14VCC 9 8 SN74LVC06A7 GND U20 14VCC 11 10 SN74LVC06A7 GND U20 14VCC 13 12 SN74LVC06A7 GND 3 VCC3_3 U19 VCC 14 3 4 B 7 GND SN74LVC07A U19 VCC 14 11 10 7 GND SN74LVC07A U19 VCC 14 13 12 7 GND SN74LVC07A A TITLE: INTEL(R) 820 CHIPSET DUAL PROCESSOR CUSTOMER REFERENCE BOARD REV: DECOUPLING 3.03 R PCD PLATFORM DESIGN DRAWN BY: PROJECT: 1900 PRAIRIE CITY ROAD FOLSOM, CALIFORNIA 95630 LAST REVISED: SHEET: 11-29-1999_14:44 36 OF 38 2 1