Intel VC820 Design Guide - Page 159
Power Plane Splits, 6.3 Thermal Design Power, Power Plane Split Example
View all Intel VC820 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 159 highlights
System Design Considerations 6.2 Power Plane Splits Figure 6-4 shows an EXAMPLE of the power plane splits on an Intel® 820 chipset platform. Figure 6-4. Power Plane Split Example 6.3 Thermal Design Power The thermal design power is the estimated maximum possible expected power generated in a component by a realistic application. It is based on extrapolations in both hardware and software technology over the life of the product. It does not represent the expected power generated by a power virus. Refer to the Intel® 820 Chipset Application Note: Thermal Design Considerations, for the thermal measurement methodology. The thermal design power numbers for the MCH, MTH, and the ICH are listed in Table 6-1. Table 6-1. Intel® 820 Chipset Component Thermal Design Power Component Thermal Design Power (133/400 MHz) MCH MTH ICH 3.5W ±15% 2.5W ±15% 1.3W ±15% Intel®820 Chipset Design Guide 6-7