Intel VC820 Design Guide - Page 149
Board Impedance/Stackup Summary, Not Routable
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System Manufacturing 5.3.9 Board Impedance/Stackup Summary 1. 7628 Cloth, 1 ply 0.007" when cured with 40% resin is the most popular and highest volume PCB in production today. This stackup will make routing impossible. • Fab Construction (4 Layers) • Zo = 70 Ω ± 15% Figure 5-3. 7 mil Stackup (Not Routable) Component Side Layer: 1/2 oz Cu 7 Mil Prepreg Ground Layer 2: 1 oz Cu Not Routable Ground Layer 3: 1 oz Cu 7 Mil Prepreg Solder Side Layer 4: 1/2 oz Cu Total Thickness = 62 mils 2. 2116 Cloth, 1 ply 0.0045" when cured with 53% resin is the second largest volume in production today. Due to the impedance & layout requirement of traces for Direct RDRAM, AGP 2.0, and hub interface, this stackup is recommended for Intel® 820 chipset platform design. • Fab Construction (4 Layers) • Zo = 60 ohms ± 10% Figure 5-4. 4.5 mil Stackup Component Side Layer: 1/2 oz Cu 4.5 Mil Prepreg Ground Layer 2: 1 oz Cu ~48 Mil Core Ground Layer 3: 1 oz Cu 4.5 Mil Prepreg Solder Side Layer 4: 1/2 oz Cu Total Thickness = 62 mils 4 5 il t k d Intel®820 Chipset Design Guide 5-5