Home » Intel Manuals » Motherboards » Intel VC820 » Manual Viewer

Intel VC820 Design Guide - Page 73

System Bus Ground Plane Reference, 2.10 S.E.C.C. 2 Grounding Retention Mechanism (GRM)

Add to My Manuals
Save this manual to your list of manuals

Page 73 highlights

Layout/Routing Guidelines 2.9.2 System Bus Ground Plane Reference All system bus signals must be referenced to GND to provide optimal current return path. The ground reference must be continuous from the MCH to the SC242 connector. This may require a GND reference island on the plane layers closest to the signals. Any split in the ground island will provide a sub-optimal return path. In a 4 layer board, this will require the VCCID island to be on an outer signal layer. Figure 2-38 shows a four layer motherboard power plane with ground reference for system bus signals. Figure 2-38. Ground Plane Reference (Four Layer Motherboard) Required SC242 GND Plane 2.10 MCH 4laym pwr plane vsd S.E.C.C. 2 Grounding Retention Mechanism (GRM) Intel is enabling a new S.E.P.P. (Single Edge Processor Package) style retention mechanism which will provide a grounding path for the heatsink on processors in the S.E.C.C. 2 package. This solution is referred to as the S.E.C.C.2 (Single Edge Contact Cartidge 2) Grounding Retention Mechanism (GRM). OEMs who choose to utilize this new solution will need to add grounding pads on the primary side of the motherboard which will interface with the enabled GRM. If the motherboard or heat sink do not have the proper interfaces, the GRM may not be utilized to its full ability and damage could occur to the motherboard. The most notable interface requirement to accommodate the GRM is the addition of grounding pads around two of the Retention Mechanism (RM) mounting holes within the existing RM keepout zone on the motherboard. The other interface is a contact area on the heat sink flanges. The interface size and locations for the motherboard are discussed in detail further in this section. The reference design GRM is asymmetric, and requires 0.159" mounting holes. To minimize the impact to trace routing, only two ground pads are required. This makes it necessary to key the GRM to prevent the ground clips from being installed on the soldermask instead of the grounding pads. This keying is accomplished by making the GRM asymmetric. The requirement for the 0.159" mounting holes is for the supported plastic fastener attachment mechanism. Intel®820 Chipset Design Guide 2-47

Section	Page
Introduction 1	13
1.1 About This Design Guide	13
1.2 References	14
1.3 System Overview	14
1.3.1 Chipset Components	15
1.3.2 Bandwidth Summary	16
1.3.3 System Configuration	17
1.4 Platform Initiatives	20
1.4.1 Direct Rambus*	20
1.4.2 Streaming SIMD Extensions	20
1.4.3 AGP 2.0	20
1.4.4 Hub Interface	20
1.4.5 Manageability	21
1.4.6 AC’97	22
1.4.7 Low Pin Count (LPC) Interface	23
Layout/Routing Guidelines 2	27
2.1 General Recommendations	27
2.2 Component Quadrant Layout	27
2.3 Intel® 820 Chipset Component Placement	29
2.4 Core Chipset Routing Recommendations	30
2.5 Source Synchronous Strobing	31
2.6 Direct Rambus* Interface	33
2.6.1 Stackup	34
2.6.2 Direct Rambus* Layout Guidelines	34
2.6.2.1 RSL Routing	34
2.6.2.2 RSL Termination	37
2.6.2.3 Direct Rambus* Ground Plane Reference	39
2.6.2.4 Direct Rambus* Connector Compensation	40
2.6.2.5 RSL Signal Layer Alternation	46
2.6.2.6 Length Matching Methods	47
2.6.2.7 VIA Compensation	49
2.6.2.8 Length Matching & Via Compensation Example	49
2.6.3 Direct Rambus* Reference Voltage	51
2.6.4 High-speed CMOS Routing	51
2.6.4.1 SIO Routing	52
2.6.4.2 Suspend-to-RAM Shunt Transistor	52
2.6.5 Direct Rambus* Clock Routing	54
2.6.6 Direct Rambus* Design Checklist	54
2.7 AGP 2.0	57
2.7.1 AGP Interface Signal Groups	58
2.7.2 1X Timing Domain Routing Guidelines	59
2.7.3 2X/4X Timing Domain Routing Guidelines	59
2.7.4 AGP 2.0 Routing Summary	61
2.7.5 AGP Clock Routing	62
2.7.6 General AGP Routing Guidelines	62
2.7.7 VDDQ Generation and TYPEDET#	63
2.7.8 VREF Generation for AGP 2.0 (2X and 4X)	65
2.7.9 Compensation	67
2.7.10 AGP Pull-ups	67
2.7.10.1 AGP Signal Voltage Tolerance List	68
2.7.11 Motherboard / Add-in Card Interoperability	68
2.8 Hub Interface	69
2.8.1 Data Signals	70
2.8.2 Strobe Signals	70
2.8.3 HREF Generation/Distribution	70
2.8.4 Compensation	71
2.9 System Bus Design	72
2.9.1 100/133 MHz System Bus	72
2.9.2 System Bus Ground Plane Reference	73
2.10 S.E.C.C. 2 Grounding Retention Mechanism (GRM)	73
2.11 Processor CMOS Pullup Values	75
2.12 Additional Host Bus Guidelines	78
2.13 Ultra ATA/66	82
2.13.1 Ultra ATA/66 Detection	82
2.13.2 Ultra ATA/66 Cable Detection	83
2.13.3 Ultra ATA/66 Pullup/Pulldown Requirements	86
2.14 AC’97	87
2.14.1 AC’97 Signal Quality Requirements	89
2.14.2 AC’97 Motherboard Implementation	89
2.15 USB	91
2.16 ISA (82380AB)	92
2.16.1 ICH GPIO connected to 82380AB	92
2.16.2 Sub Class Code	92
2.17 IOAPIC Design Recommendation	92
2.18 SMBus/Alert Bus	93
2.19 PCI	93
2.20 RTC	93
2.20.1 RTC Crystal	94
2.20.2 External Capacitors	94
2.20.3 RTC Layout Considerations	95
2.20.4 RTC External Battery Connection	95
2.20.5 RTC External RTCRST Circuit	96
2.20.6 RTC Routing Guidelines	96
2.20.7 VBIAS DC Voltage and Noise Measurements	97
Advanced System Bus Design 3	101
3.1 Terminology and Definitions	101
3.2 AGTL+ Design Guidelines	104
3.2.1 Initial Timing Analysis	105
3.2.2 Determine General Topology, Layout, and Routing Desired	108
3.2.3 Pre-Layout Simulation	108
3.2.3.1 Methodology	108
3.2.3.2 Sensitivity Analysis	108
3.2.3.3 Monte Carlo Analysis	109
3.2.3.4 Simulation Criteria	109
3.2.4 Place and Route Board	110
3.2.4.1 Estimate Component To Component Spacing for AGTL+ Signals	110
3.2.4.2 Layout and Route Board	110
3.2.4.3 Host Clock Routing	112
3.2.4.4 APIC Data Bus Routing	112
3.2.5 Post-Layout Simulation	113
3.2.5.1 Intersymbol Interference	113
3.2.5.2 Cross-Talk Analysis	113
3.2.5.3 Monte Carlo Analysis	113
3.2.6 Validation	114
3.2.6.1 Measurements	114
3.2.6.2 Flight Time Simulation	114
3.2.6.3 Flight Time Hardware Validation	115
3.3 Theory	115
3.3.1 AGTL+	115
3.3.2 Timing Requirements	116
3.3.3 Cross-talk Theory	116
3.3.3.1 Potential Termination Cross-Talk Problems	118
3.4 More Details and Insight	119
3.4.1 Textbook Timing Equations	119
3.4.2 Effective Impedance and Tolerance/Variation	120
3.4.3 Power/Reference Planes, PCB Stackup, and High Frequency Decoupling	120
3.4.3.1 Power Distribution	120
3.4.3.2 Reference Planes and PCB Stackup	121
3.4.3.3 High Frequency Decoupling	122
3.4.3.4 SC242 Connector	123
3.4.4 Clock Routing	123
3.5 Definitions of Flight Time Measurements/ Corrections and Signal Quality	124
3.5.1 VREF Guardband	124
3.5.2 Ringback Levels	124
3.5.3 Overdrive Region	124
3.5.4 Flight Time Definition and Measurement	125
3.6 Conclusion	126
Clocking 4	129
4.1 Clock Generation	129
4.2 Component Placement and Interconnection Layout Requirements	134
4.2.1 14.318MHz Crystal to CK133	134
4.2.2 CK133 to DRCG	134
4.2.3 MCH to DRCG	135
4.2.4 DRCG to RDRAM Channel	136
4.2.5 Trace Length	136
4.3 DRCG Impedance Matching Circuit	138
4.3.1 DRCG Layout Example	139
4.4 AGP Clock Routing Guidelines	139
4.5 Series Termination Resistors for CK133 Clock Outputs	139
4.6 Unused Outputs	140
4.7 Decoupling Recommendation for CK133 and DRCG	140
4.8 DRCG Frequency Selection and the DRCG+	140
4.8.1 DRCG Frequency Selection Table and Jitter Specification	140
4.8.2 DRCG+ Frequency Selection Schematic	141
System Manufacturing 5	145
5.1 In Circuit FWH Flash BIOS Programming	145
5.2 FWH Flash BIOS Vpp Design Guidelines	145
5.3 Stackup Requirement	145
5.3.1 Overview	145
5.3.2 PCB Materials	146
5.3.3 Design Process	146
5.3.4 Test Coupon Design Guidelines	147
5.3.5 Recommended Stackup	147
5.3.6 Inner Layer Routing	147
5.3.7 Impedance Calculation Tools	148
5.3.8 Testing Board Impedance	148
5.3.9 Board Impedance/Stackup Summary	149
System Design Considerations 6	153
6.1 Power Delivery	153
6.1.1 Terminology and Definitions	153
6.1.2 Intel® 820 Chipset Customer Reference Board Power Delivery	154
6.1.3 64/72Mbit RDRAM Excessive Power Consumption	157
6.1.3.1 Option 1: Reduce the Clock Frequency During Initialization	158
6.1.3.2 Option 2: Increase the Current Capability of the 2.5V Voltage Regulator	158
6.2 Power Plane Splits	159
6.3 Thermal Design Power	159
6.4 Glue Chip 3 (Intel® 820 Chipset Glue Chip)	160
Appendix A: Reference Board Schematics: Uni-Processor	161
Reference Design Schematics: Uni-Processor A	163
Appendix B: Reference Design Schematics: Dual-Processor B	201

Match case Limit results 1 per page

Intel

820 Chipset

Design Guide

2-47

Layout/Routing Guidelines

2.9.2

System Bus Ground Plane Reference

All system bus signals must be referenced to GND to provide optimal current return path. The

ground reference must be continuous from the MCH to the SC242 connector. This may require a

GND reference island on the plane layers closest to the signals. Any split in the ground island will

provide a sub-optimal return path. In a 4 layer board, this will require the VCCID island to be on an

outer signal layer.

Figure 2-38

shows a four layer motherboard power plane with ground reference

for system bus signals.

2.10

S.E.C.C. 2 Grounding Retention Mechanism (GRM)

Intel is enabling a new S.E.P.P. (Single Edge Processor Package) style retention mechanism which

will provide a grounding path for the heatsink on processors in the S.E.C.C. 2 package. This

solution is referred to as the S.E.C.C.2 (Single Edge Contact Cartidge 2) Grounding Retention

Mechanism (GRM). OEMs who choose to utilize this new solution will need to add grounding

pads on the primary side of the motherboard which will interface with the enabled GRM. If the

motherboard or heat sink do not have the proper interfaces, the GRM may not be utilized to its full

ability and damage could occur to the motherboard.

The most notable interface requirement to accommodate the GRM is the addition of grounding

pads around two of the Retention Mechanism (RM) mounting holes within the existing RM keep-

out zone on the motherboard. The other interface is a contact area on the heat sink flanges. The

interface size and locations for the motherboard are discussed in detail further in this section.

The reference design GRM is asymmetric, and requires 0.159” mounting holes. To minimize the

impact to trace routing, only two ground pads are required. This makes it necessary to key the

GRM to prevent the ground clips from being installed on the soldermask instead of the grounding

pads. This keying is accomplished by making the GRM asymmetric. The requirement for the

0.159” mounting holes is for the supported plastic fastener attachment mechanism.

Figure 2-38. Ground Plane Reference (Four Layer Motherboard)

MCH

Required

SC242

GND Plane

4laym pwr plane vsd