Intel VC820 Design Guide - Page 160
Glue Chip 3 (Intel® 820 Chipset Glue Chip), Table 6-2. Glue Chip 3 Vendors - audio driver
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System Design Considerations 6.4 Glue Chip 3 (Intel® 820 Chipset Glue Chip) To reduce the component count and BOM cost of the Intel® 820 chipset platform, Intel has developed an ASIC component that integrates miscellaneous platform logic into a single chip. The Glue Chip 3 is designed to integrate some or all of the following functions into a single device. By integrating much of the required glue logic into a single device, overall board cost can be reduced. Features • PWROK signal generation • Control circuitry for Suspend To RAM • Power Supply power up circuitry • RSMRST# generation • Backfeed cutoff circuit for suspend to RAM • 5V reference generation • Flash FLUSH# / INIT# circuit • HD single color LED driver • IDE reset signal generation/PCIRST# buffers • Voltage translation for Audio MIDI signal • Audio-disable circuit • Voltage translation for DDC to monitor • Tri-state buffers for test More information regarding this component is available from the following vendors: Table 6-2. Glue Chip 3 Vendors Vendor Intel Contact Fujitsu Microelectronics Customer Response Center Mitel Semiconductor Mitel Semiconductor Contact Information 3545 North 1st Street, M/S 104 San Jose, CA 95134-1804 fax: 1-408-922-9179 email: [email protected] http://www.mitelsemi.com 6-8 Intel®820 Chipset Design Guide