HP rp3440 User Service Guide, Sixth Edition - HP 9000 rp3410/rp3440 - Page 45

Environmental Temperature Sensor, Nonoperating Environment, Cooling, CPU and Memory Cooling

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per 1,000 feet of elevation above 5,000 feet above sea level up to 30°C at 10,000 feet. For optimum reliability and performance, the recommended operating range is 20°C to 25°C and 40% - 55% relative humidity. Ambient intake air temperature is often different from ambient room temperature. Measure the operating temperature and humidity directly in front of the cabinet cooling air intakes rather than just checking ambient room conditions. Environmental Temperature Sensor The server includes internal sensors that monitor input air temperature and server operating temperatures. The ambient air temperature is measured using a sensor placed on the system I/O board. Data from the sensor is used to control the fan speed and to initiate system overtemperature shutdown. Nonoperating Environment The system is designed to withstand ambient temperatures between -40°C to 70°C under nonoperating conditions. Cooling This section provides information on the cooling systems in the server. CPU and Memory Cooling The server incorporates front to back airflow across the processor and memory extender boards and through the HDD backplane. Two 127 mm dual fan assemblies, mounted vertically in the center of the chassis, pull air through the processor and memory section and push air through the PCI section. Each processor and memory dedicated dual fan assembly is controlled by smart fan control circuits embedded in the system I/O board. The smart fan control circuit receives fan control input from the system fan controller in the I/O board, and returns fan status information to the system fan controller. The smart fan circuit controls the power and the pulse-width-modulated control signal to the fan and monitors the speed indicator back from each of the fans. The fan status LED is driven by the smart fan circuit. The fan status LED is located on the diagnostic board inside the system. Bulk Power Supply Cooling Cooling for the bulk power supplies is provided by one 120 mm dual fan assembly and one externally mounted 60 mm power supply fan. Air is pushed into both power supply bays by the 120 mm fan assembly and exhausted out the rear by the 60 mm fan (one per power supply). Air flows out of the rear of the chassis with minimal leakage into the cell airflow plenum. NOTE: A power supply filler is required in the unused power supply slot to maintain proper airflow throughout the system. PCI and Mass Storage Section Cooling Two dual fan assemblies located at the center of the chassis provide airflow for all the PCI slots. Airflow is over the processor and memory extender boards and into the PCI section. The fans are controlled by the system temperature and run at the speed necessary to maintain proper internal temperature throughout the chassis. Environmental Specifications 45

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per 1,000 feet of elevation above 5,000 feet above sea level up to 30°C at 10,000 feet. For optimum
reliability and performance, the recommended operating range is 20°C to 25°C and 40% – 55%
relative humidity.
Ambient intake air temperature is often different from ambient room temperature. Measure the
operating temperature and humidity directly in front of the cabinet cooling air intakes rather
than just checking ambient room conditions.
Environmental Temperature Sensor
The server includes internal sensors that monitor input air temperature and server operating
temperatures. The ambient air temperature is measured using a sensor placed on the system I/O
board. Data from the sensor is used to control the fan speed and to initiate system overtemperature
shutdown.
Nonoperating Environment
The system is designed to withstand ambient temperatures between -40°C to 70°C under
nonoperating conditions.
Cooling
This section provides information on the cooling systems in the server.
CPU and Memory Cooling
The server incorporates front to back airflow across the processor and memory extender boards
and through the HDD backplane. Two 127 mm dual fan assemblies, mounted vertically in the
center of the chassis, pull air through the processor and memory section and push air through
the PCI section.
Each processor and memory dedicated dual fan assembly is controlled by smart fan control
circuits embedded in the system I/O board. The smart fan control circuit receives fan control
input from the system fan controller in the I/O board, and returns fan status information to the
system fan controller. The smart fan circuit controls the power and the pulse-width-modulated
control signal to the fan and monitors the speed indicator back from each of the fans. The fan
status LED is driven by the smart fan circuit. The fan status LED is located on the diagnostic
board inside the system.
Bulk Power Supply Cooling
Cooling for the bulk power supplies is provided by one 120 mm dual fan assembly and one
externally mounted 60 mm power supply fan. Air is pushed into both power supply bays by the
120 mm fan assembly and exhausted out the rear by the 60 mm fan (one per power supply).
Air flows out of the rear of the chassis with minimal leakage into the cell airflow plenum.
NOTE:
A power supply filler is required in the unused power supply slot to maintain proper
airflow throughout the system.
PCI and Mass Storage Section Cooling
Two dual fan assemblies located at the center of the chassis provide airflow for all the PCI slots.
Airflow is over the processor and memory extender boards and into the PCI section. The fans
are controlled by the system temperature and run at the speed necessary to maintain proper
internal temperature throughout the chassis.
Environmental Specifications
45