HP Cluster Platform Interconnects v2010 Quadrics QsNetII Interconnect - Page 27

Interconnect Fan and Power Supply Modules

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The QM503 controller card distributes the master clock to all cards in the interconnect. In addition, it has an embedded processor for controlling and monitoring the interconnect via a login by local terminal or remote network connection. For clusters with greater than 128 nodes, the interconnect enclosure is configured as a node-level interconnect (NLI) or a top-level interconnect (TLI). These configurations require difference midplanes and combinations of QM501 and QM502 switch cards. For complete information on the interconnect configurations supported for HP Cluster Platform, cabling tables. 3.2.1 Interconnect Fan and Power Supply Modules The interconnect enclosure has a 17 U high, 510 mm deep, screened enclosure designed for installation in industry-standard 19 inch (600 mm) equipment racks. In an HP Cluster Platform, it is mounted in the HP model 10642 rack. The enclosure is air cooled with the air flowing from front to back through the unit. There is provision in the enclosure for two QM562 fan trays, front and up to two QM561 power supply units. The two QM561 power supply units can be hot-swapped and provide dual redundancy. The QM561 power supply units are universal 1250 W power supplies operating in the range 100-240 VAC (50/60 Hz). The interconnect only requires that one of these QM561 power supply units is functioning correctly at any time. Connection of power to the equipment is through a pair of standard IEC320 inlets connected to the rack's power distribution unit (PDU). Figure 3-2 shows the power supply location. Figure 3-2: Power Supply Location QUaDrics QsNet" Fan B/Ctrl B Slot 4 Slot 5 Slot 6 Slot 7 PSU A PSU A PSU B PSU B HPTC-0030 128-Port Interconnect Modules 3-3

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The QM503 controller card distributes the master clock to all cards in the
interconnect. In addition, it has an embedded processor for controlling and
monitoring the interconnect via a login by local terminal or remote network
connection.
For clusters with greater than 128 nodes, the interconnect enclosure is configured
as a node-level interconnect (NLI) or a top-level interconnect (TLI). These
configurations require difference midplanes and combinations of QM501 and
QM502 switch cards.
For complete information on the interconnect configurations supported for HP
Cluster Platform, cabling tables.
3.2.1 Interconnect Fan and Power Supply Modules
The interconnect enclosure has a 17 U high, 510 mm deep, screened enclosure
designed for installation in industry-standard 19 inch (600 mm) equipment
racks. In an HP Cluster Platform, it is mounted in the HP model 10642 rack.
The enclosure is air cooled with the air flowing from front to back through the
unit. There is provision in the enclosure for two QM562 fan trays, front and up
to two QM561 power supply units. The two QM561 power supply units can be
hot-swapped and provide dual redundancy. The QM561 power supply units are
universal 1250 W power supplies operating in the range 100-240 VAC (50/60 Hz).
The interconnect only requires that one of these QM561 power supply units is
functioning correctly at any time. Connection of power to the equipment is through
a pair of standard IEC320 inlets connected to the rack’s power distribution unit
(PDU). Figure 3-2 shows the power supply location.
Figure 3-2: Power Supply Location
PSU A
PSU B
Slot 6
Slot 7
Slot 4
Slot 5
Fan B/Ctrl B
PSU A
PSU B
QU
a
D
rics
QsNet"
QsNet"
HPTC-0030
128-Port Interconnect Modules
3-3